AOI Inspection Machine Inpex Series

Core Technologies & Features of 2D AOI

1.  Precise Localization

Our AOI adopts telecentric lenses without distortion effect, a multi-reference point calibration method, and automatic localization of an inspection window, including double localization of the pad and body. It solves the problem of offset caused by board deformation and greatly reduces false alarms.

2.  Incoming Material Difference Compatibility

Our AOI adopts multi-level color taking and is more compatible with material color differences. It effectively avoids false alarms caused by material color discrepancies across different batches.

.  IC Pin Defect Detection

The system automatically locates all pin frames and accurately confirms the position of each pin’s front end. Defects detected include:

• Multiple pins raised
• Pin deformation
• Pin short circuit
• Pin elongation beyond set range (NG/OK output)

Featured Functions

• Centralized Management: Centralized management of coating AOI in the production lines achieves remote review, offline programming, and debugging.
• Automatic Line Change by Scanning Codes: Automatically adjusts width and calls the program by identifying the PCB barcode. No manual participation is required; supports MES instructions.
• Powerful SPC: Rich data charts meet the needs of on-site quality tracking and quality analysis.
• Output Entire Image: After the end of the test, a full board image captured under different light sources is output to meet post-stage quality traceability requirements.
• Barcode Function: Supports one-dimensional or two-dimensional barcode recognition.
• Close-Loop Feedback: Coating AOI may communicate with coating or dispensing machines for data exchange to achieve closed-loop feedback.

SMT Line Integration

Our 2D AOI integrates seamlessly into a complete SMT production line:

SPI  →  Pre-Reflow AOI  →  Reflow Oven  →  Post-Reflow AOI

Inspection Items

SMT Inspection Items: Nonexistent solder, insufficient solder, excessive solder, cavity, short circuit, exposed copper, false solder, buried pins, solder ball, and contamination.

THT Inspection Items: Wrong parts, missing parts, reverse, offset, tombstoning, side stand, flip parts, damaged solder, short circuit, insufficient solder, false solder, missing solder, excessive glue, exposed copper, pin warpage, and pin deformation.

Technical Specifications

Online 2D Automatic Optical Inspection Equipment — Model Comparison

Parameter	Inpex-A510D Single-Track	Inpex-A510D Dual-Track	Inpex-M300 Bottom Projection	Inpex-M400 Double-Sided
Camera	5MP Industrial (Optional: 12MP)	5MP Industrial (Optional: 12MP)	12MP Industrial	12MP Industrial
Lens	Telecentric	Telecentric	Telecentric	Telecentric
Light Source	RGB Three-Color	RGB Three-Color	RGB Three-Color	RGB Three-Color
Resolution	10μm: 24×20mm 15μm: 36×30mm 25μm: 57×48mm	10μm: 24×20mm 15μm: 36×30mm 25μm: 57×48mm	16.5μm: 64×48mm 10μm: 40×30mm	16.5μm: 64×48mm 10μm: 40×30mm
Max PCB Size	460×350mm	Single: 460×560mm Dual: 460×300mm	510×460mm	510×460mm
PCB Thickness	0.3–5mm	0.3–5mm	0.3–5mm	0.3–5mm
Edge Width	3mm	3mm	3mm	3mm
Top/Bot Clearance	Ex-factory: TOP 30mm / BOT 30mm Max: TOP 50mm / BOT 50mm	Ex-factory: BOT 30mm Max: BOT 50mm	Ex-factory: TOP 50mm / BOT 30mm Max: TOP 50mm / BOT 50mm	Ex-factory: TOP 50mm / BOT 30mm Max: TOP 50mm / BOT 50mm
Max PCB Weight	5 KG	7 KG	5 KG	7 KG
Inspection Speed	230–300ms/FOV	230–300ms/FOV	230–300ms/FOV	230–300ms/FOV
X, Y Motion	Servo Motor	Servo Motor	Servo Motor	Servo Motor
Operating System	Windows 10 64-bit	Windows 10 64-bit	Windows 10 64-bit	Windows 10 64-bit
Power Supply	AC220V, 50/60Hz	AC220V, 50/60Hz	AC220V, 50/60Hz	AC220V, 50/60Hz
Air Pressure	0.5 MPa	0.5 MPa	0.5 MPa	0.5 MPa
Track Height	900±20mm	900±20mm (Custom: 750±20mm)	900±20mm	900±20mm
Machine Weight	~700 KG	~800 KG	~1000 KG	~1300 KG
Machine Size	L892×W1090×H1585mm	L892×W1445×H1585mm	L1080×W1493×H1615mm	L1080×W1493×H1615mm